411 Microsphere Blend is a low density filler used as a thickening agent with WEST SYSTEM? Epoxy to create a lightweight filling putty, with excellent filleting characteristics. WEST SYSTEM? epoxy thickened with 411 Microsphere Blend is also used as a low density adhesive for edge-gluing cedar and DuraKore for strip plank construction.
The inclusion of 411 Microsphere Blend into the resin and hardener mix, essentially produces a cellular structure with some loss of tensile and compressive strength, but flexibility remains excellent. Pot-life of the epoxy mixture decreases with the inclusion of the Microsphere Blend although overall cure rate in thin layers is little changed.
For more specific application guidance, please refer to the Product Datasheet.
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